Ratio of the Knoop microhardness of the titanium-nitride-deposited and untreated inconel 718 samples, as a function of load.
The substrate temperature in PVD (300-500 C) is considerably lower than those used in CVD but may still be undesirable for many applications.
This step performs the ibed portion of the process.
Want to thank TFD for its existence?Tribological property improvements are attributed to both higher hardness and lower coefficient of friction of the titanium-nitride film.Composition-depth profiling was done with geant casino narbonne ouvert dimanche a scanning Auger microprobe (SAM) using an Ar ion gun for sputtering.During sputter deposition of Ti, Ar ions impinge upon the Ti cathode with kinetic energy of 600 eV, assuming a singly charged ion.The process was carried out at ambient temperature by alternately depositing titanium with a dc cathode sputter source followed by nitrogen implantation utilizing a plasma.This step transforms the titanium film to a titanium-nitride film and introduces further dynamic mixing of the interface.The sputtered Ti atoms are ejected at various angles from the cathode surface.The irregularities observed at the edge of the film are a consequence of inherent difficulties encountered in electropolishing by the back 370.The Knoop microhardness test was selected because its major diagonal to depth ratio (30:1) provides for a high resolution measurement in hardness as a function of depth (14).5 thinning process, which are further augmented by different electropolishing rates of the base material and the coating.SR idharan,.During the pulse, N ions are accelerated toward the substrate surface.Ion implantation techniques have proved to be very effective in the production of compounds with predetermined (possibly non-equilibrium) composition, whose characteristics are interesting for the improvement of surface properties (wear-, corrosion-, thermal oxidation resistance) (1).Although deposition rates here are lower than for either PVD or CVD processes, ibed has the advantage of being carried out at a lower temperature.
The slight difference between the two cases, in the initial stages of the test, is within the resolution of the measuring apparatus.
Et al: Handbook of Auger Electron Spectroscopy, Physical Electronics Division, Perkin Elmer, Eden Prairie, MN, (1978).
Doi, Thin Solid Films, 48, 67 (1978).
I Ti (a) Co fIG.
Tzatzov, Surface Sci., 149, 105 (1985).
I Load (grams) FIG.
5 nitrides 373 Conclusions It has been demonstrated that a titanium-nitride film can be successfully deposited, at low temperature, by alternately sputter depositing titanium followed by implantation with nitrogen using a plasma.TiN on inconel 718-ibed - TiN on Tool Steel-PVD.The final titanium- nitride film thickness was -0.25.87 /8, (1985).Eng., Al15, 369 (1989).Link to this page: a).However, even at the lowest load employed (0.5 grn) the indentation depth (-0.13 pro) is large enough to include substrate effects so that the improvement in hardness is somewhat underestimated.Profile of the wear track for the untreated and titanium-nitride-deposited sample (before breakthrough) after the pin-on-disk wear test was performed under identical test conditions.
For comparison, the results of similar measurements made on a substantially thicker titanium-nitride layer deposited on a tool steel by the PVD process is also shown.
2) indicate the formation of stoichiometric titanium-nitride along with reasonable oxygen and carbon concentrations.